According to a recent report from the folks over at DigiTimes, China’s Jiangsu Changjiang Electronics Technology, better known as JCET, has recently won orders to assemble system-in-package (SiP) modules for Apple in 2016. STATS ChipPAC, a company recently acquired by JCET earlier this year, already has certification from Apple for its Korean operation. JCET is expected to join Apple’s existing SiP assembly partners, including Murata and Universal Scientific Industrial (part of Advanced Semiconductor Engineering).
The move could mean Apple is anticipating a significant demand for products that are using SiP technology considering JCET is China’s biggest semiconductor packaging and test services firm. The sources didn’t identify which products would be using the technology though. As of right now, Apple’s primary example of SiP design is the S1 processor in the Apple Watch, which is something necessary in order to fit so many components on a person’s wrist.
The Cupertino California company is already said to be working on a second-generation Watch. It’s features are currently unknown but Apple is presumably planning on including an upgraded processor to go with it. A third SiP assembly partner could potentially alleviate some of the bottlenecks that hampered the launch of the first-gen Watch. Initially the product was restricted to online orders as well as a handful of luxury boutiques. The company had to wait until June for its own retail outlets to begin sales once again and third-party chains had to wait until August.
We’ll have to wait and see what the third supplier was for.